Beijing Elite Photonics Technologies Co.,Ltd. headquarter is located in Shunyi GLP I-Park, Zhongguancun, Beijing. It is a high-tech enterprise specializing in the design of next-generation silicon optoelectronic integrated circuits. The company has gathered an excellent team of international experts in the field of silicon optoelectronics and has established a complete supply chain for its silicon photonics chip production, which includes design, foundry, packaging and testing. The company is committed to promote the development of domestic silicon photonics industry and become an innovative leader in the field.

The core technical team of Elite Photonics has vast experience in the research and development of integrated microwave devices (MMIC), photonic integrated circuits (PIC), photonic system design, and wafer processing technology. The team is expert in the design and production of integrated optical passive devices such as MMI, directional couplers, Mux/Demux, MZM, edge couplers, and etc. They are one of the earliest teams in China to engage in the silicon photonic chip design. These are the key contributing factors to the company's ability to swiftly develop mass-producible high-performance silicon photonic products.  

The core management and operation team of Elite Photonics has accumulated many years of experience in the integrated circuit industry. The operating team has achieved impressive results in their respective domains. They have great expertise in project management, marketing and sales, and establishing supply chain resources for the company products. All these provide a solid foundation for the company and making it a leader in the silicon optoelectronics ind.

The silicon photonic products developed by Elite Photonics are divided into two categories:

1.For data centers: 400G DR4/FR4, 800G DR8/2xDR4/2xFR4, and 800G DR8 series.                                                                      2.For telecommunications transmission and data center interconnection (DCI): 400G/800G ZR series. The core silicon photonic products are based on the Silicon-On-Insulator (SOI) platform, compatible with Complementary Metal-Oxide-Semiconductor (CMOS) microelectronic fabrication processes. They are inherently mass producible, scalable, have ultra-high precision and high cost effectiveness. Combined with the advantages of photonic technology which is high speed and low power consumption, the overall performance of the chips is leading at domestic level, and competitive at the international level. The products can be widely used in the fields of data centers, telecommunications, 5G/6G transmission, optical sensing, automotive radar and etc.