Responsibilities:

1.Responsible for chip sales, achieving the company's performance targets.

2.Understand customer needs, explore their potential value, actively coordinate and allocate internal and external resources, and continuously improve customer satisfaction.
3.Promote the company's marketing and sales strategy, collect customer and industry information, and provide reasonable suggestions based on market feedback.

Requirements:

1.Bachelor's degree or higher, preferably in computer science, microelectronics, semiconductor materials, or related fields.
2.5 years or more of B2B business sales experience, with at least 3 years of experience in chip industry sales.
3.Strong business development capabilities with a proven track record.
4.Motivated, resilient under pressure, and excellent communication skills.

Responsibilities:

1.Design,simulate, and optimize silicon photonics chip devices.
2.System-level design, simulation, and layout of photonic chips.
3.Develop testing schemes for silicon photonics devices, process and analyze test data.
4.Collaborate on product module packaging and optical design.
5.Contribute to the establishment of a systematic storage of data, layouts, and design documents.
6.Assist in intellectual property applications.

Requirements:

1.Familiarity with Lumerical and Luceda simulation software.
2.PhD in optics, optical engineering, optoelectronics, or related fields.
3.Knowledge of optoelectronic device principles, with a preference for expertise in silicon-based passive and active devices.
4.Proficiency in English.
5.Proficient in simulation software such as Lumerical, Luceda, or COMSOL.
6.Experience in layout design and tape-out.
7.Detail-oriented,strong communication skills, and teamwork.

Responsibilities:

1.Develop high-speed TIA and Driver ICs.
2.Design, simulate, optimize, and analyze chip and system-level designs.
3.Assist in test plan development, provide testing support, and help with product issue analysis.
4.Layout design, optimization, and verification.
5.Coordinate with the photonics chip department to ensure optical-electrical chip functionality.
6.Write technical documents and patents.

Requirements:

1.Master's degree or higher in microwave/millimeter-wave, microelectronics, or related fields, with at least 3 years of relevant work experience.
2.Experience in CMOS/SiGe RFIC, SERDES design and simulation verification.
3.Familiarity with software tools such as Cadence, HFSS.
4.Experience in TIA, modulator driver, RF, and MMIC chip design.
5.Strong skills in technical documentation and report writing, with proficiency in English.
6.Diligent, good communication skills, and a team player.

Responsibilities:

1.Analyze market trends, customer pain points, and competitive situations in collaboration with the company's marketing team.
2.Define product  specifications in collaboration with internal R&D teams and drive necessary trade-offs.
3.Conduct technical parameter testing in the laboratory and organize the output.
4.Prepare datasheets and application documents.
5.Support the marketing team in integrating the company's products into customer  projects and assist in resolving technical issues.
6.Other related tasks.

Requirements:

1.Over 3 years of experience in optical module development, with expertise in optical module systems and extensive experience in development and debugging.
2.Understanding of the technical parameters and applications of optoelectronic chips, devices, and applications.
3.Familiarity with optical communication systems and their applications in various industries.
4.Strong teamwork skills, the ability to understand the needs of others in complex, cross-functional projects, and find solutions.
5.Excellent verbal and written communication skills, with proficiency in English.
6.Honesty, a proactive attitude, and experience in problem-solving.

Responsibilities:

1.Project management for the complete development cycle of chip products, ensuring  projects are executed according to plan.
2.Participation in project initiation, changes, reviews, risk assessments, acceptance, closure, retrospectives, and capitalization processes.
3.Development of  project objectives, budgets, development schedules, personnel assignments, and resource allocation.
4.Coordination of project implementation, collaboration to drive various cross-functional teams, tracking project progress, and identifying potential risks.
5.Participation in defining milestone acceptance criteria and organizing reviews, including testing pass rates, functionality and code coverage, testability design coverage, timing sign-off, and power sign-off.
6.Tracking issues during chip testing and feedback to the R&D department to promote issue resolution.
7.Assistance in driving and executing the work of the Chief Scientist.

Requirements:

1.Bachelor's degree or higher in electronics, microelectronics, communications, computer science, or related fields.
2.Familiarity with chip development processes and project management methodologies and tools, with a preference for experience in full-cycle chip management, familiarity with IPD processes, and related tools.
3.At least 5 years of experience in semiconductor development projects or quality management, with a preference for experience at large or medium-sized chip companies.
4.2 years or more of experience working or studying abroad, with the ability to communicate in both Chinese and English.
5.Strong analytical and problem-solving skills, resilience under pressure, teamwork, and excellent interpersonal communication skills.